583 Armstead Ln.
Holt, FL 32564

circuit card assemblySupport Our Troops

A Service Disabled Veteran
Native American Owned
Small Business
  • aerospace cable assembly
  • cable harness manufacturing
  • circuit card assembly
  • electro mechanical manufacturing
  • laser wire marking
  • aviation wiring harness
custom wiring harness
We are an agile manufacturer able to meet your rapid response needs.
aerospace manufacturing
Search Archives

Sales Team is a multi functional approach involving bidding liason, engineering, supply chain and finance. Certified Manufacturing gives each RFQ opportunity the focus and attention it deserves.

Recent Posts:

electromechanical manufacture

Certified Manufacturing is proud to serve Defense, Aerospace, Civilian, and Homeland Security Agencies.

supported government agencies
Certified Manufacturing

Ball Grid Array

What is a Ball Grid Array?

The Ball Grid Array or BGA, is a grid pattern of pads with balls of solder as opposed to packages using pins for connections. The circuit board contains a matching array of copper pads to complete the connection. Numerous advantages are offered by the BGA package.

  • Reduced Track Density:
    BGA spreads its contacts out over the entire span of the package which reduces track density around the package.
  • Increased Durability:
    BGA solder balls are much sturdier than traditional flat pin packages making them much easier to handle without risk of pin damage.
  • Improved Heat Dissipation:
    Lower thermal resistance between the silicon chip and the solder balls produces a far more effective conducting of heat onto the printed circuit board.
  • Higher Performance:
    With the conductors located across the bottom of the chip, shorter leads are possible within the package. Thus reducing inductance and improving performance.
BGA Solder Process

As the pads are under the device and not visible, solder reflow techniques are required. The solder balls on the package contain a very precise amount of solder. Careful control of heat results in a very reliable connection. Higher than most flat pin counterparts. This process is excellent for mass production, rework and prototyping.

BGA Solder Joint Inspection

Optical inspection of the BGA solder connection cannot be accomplished due to the connections location under the package. The connections cannot be fully tested by checking the electrical performance either. X-ray is the chosen method to inspect the integrity of the solder connection.

BGA Rework

Reworking a suspected bad component can be accomplished if the proper equipment is available. A + specialized BGA Rework station is required. Equipped with a jig fitted with infrared heater, a thermocouple to monitor the temperature and a vacuum. The solder can be melted and the component lifted for inspection or replacement.

About CMI:

Certified Manufacturing now accepts credit card payments up to $5,000 per transaction. Nominal fee is applicable and all payments must be submitted via email link from Certified Manufacturing.

Quality Cable Harness Assembly
aviation wiring harness
defense contractor
Electro Mechanical Manufacturer
boeing gold performance
Perfomance Excellence
ipc soldering certified
Soldering IPC-610
Cables IPC-620
osha approved
OSHA Compliant
member sba
Woman Owned
Small Business