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The Ball Grid Array or BGA, is a grid pattern of pads with balls of solder as opposed to packages using pins for connections. The circuit board contains a matching array of copper pads to complete the connection. Numerous advantages are offered by the BGA package.
As the pads are under the device and not visible, solder reflow techniques are required. The solder balls on the package contain a very precise amount of solder. Careful control of heat results in a very reliable connection. Higher than most flat pin counterparts. This process is excellent for mass production, rework and prototyping.
Optical inspection of the BGA solder connection cannot be accomplished due to the connections location under the package. The connections cannot be fully tested by checking the electrical performance either. X-ray is the chosen method to inspect the integrity of the solder connection.
Reworking a suspected bad component can be accomplished if the proper equipment is available. A + specialized BGA Rework station is required. Equipped with a jig fitted with infrared heater, a thermocouple to monitor the temperature and a vacuum. The solder can be melted and the component lifted for inspection or replacement.
Certified Manufacturing now accepts credit card payments up to $5,000 per transaction. Nominal fee is applicable and all payments must be submitted via email link from Certified Manufacturing.