Circuit Card Inspection

Automated Optical Inspection (AOI)

We utilize a Mirtec MV-2HTL Automated Optical Inspection System to inspect the quality of bonds between the components and the printed circuit board. The Mirtec system has proven to be a simple, flexible, universal inspection system with outstanding results. A variety of surface feature defects can be identified and corrected with AOI such as:

• Scratches and Stains
• Open circuits, Short circuits
• Thinning of the solder
• Missing components
• Incorrect components
• Incorrectly placed components.

X-Ray Inspection

Increasing use of the Ball Grid Array ( BGA ) technology has required the mplementation of a X-ray inspection systems. This system utilizes x-ray rather than visible light allowing for a comprehensive inspection of all the bonds on BGA components. At CMI we have chosen the Glenbrook Technologies 80KVA system. We have found it to be accurate and flexible.

Quality Control

At Certified Manufacturing our fully capable Circuit Card Assembly Division delivers exceptional quality. Our capitol investments in equipment and training make CMI an outstanding choice for your next electro mechanical build. Certified Manufacturing is your Outsource Resource.